Semiconductor device, circuit substrate, electro-optic device and electronic appliance
AssigneeSeiko Epson Corporation
InventorsShuichi Tanaka, Haruki Ito, Yasuhito Aruga, Ryohei Tamura, Michiyoshi Takano
Life of this patent
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Abstract
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
Claims15
A semiconductor device, comprising:
- a resin projection linearly disposed on a surface of the semiconductor device;
- a resin layer linearly disposed on the surface of the semiconductor device spaced apart and parallel to the resin projection;
- an electrode pad disposed on the surface of the semiconductor device, the electrode pad being disposed at a position relative the resin projection in a first direction orthogonal to the resin projection;
- and
- a conductive film disposed on the electrode pad and extending over the resin projection, the conductive film including:
- a first portion connected to the electrode pad that extends in the first direction;
- a second portion disposed on the resin layer that extends in a second direction opposite the first direction.
A semiconductor device, comprising:
- an elongate resin layer extending in a first direction;
- an elongate resin projection spaced apart from the resin layer, the resin projection extending parallel with the first direction;
- an electrode pad spaced part from the resin layer with the resin projection therebetween;
- and
- a conductive film disposed over the resin projection, the conductive film including a first portion connected to the electrode pad that extends in a second direction orthogonal to the first direction, and a second portion disposed over the resin layer that extends in a third direction opposite the second direction.
A semiconductor device, comprising:
- an active surface;
- an electrode pad disposed on the active surface;
- a resin projection disposed proximate the electrode pad and linearly extending in a first direction arranged orthogonal relative to a second direction at which the electrode pad is disposed relative the resin projection;
- a resin layer disposed proximate the resin projection and linearly extending in the first direction with the resin projection;
- and
- a conductive film disposed over the resin projection and between the electrode pad and the resin layer, the conductive film extending parallel with the second direction.
Dependencies are inferred from the claim text.