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US 7,888,792 B2Granted
Method for direct heat sink attachment
AssigneeInternational Business Machines Corporation
InventorTimothy J Chainer
Life of this patent
Estimating the term…
Abstract
A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink.
Claims2
A structure for attaching a heat sink to an integrated circuit chip, the structure comprising:
- a set of ball bearings positioned to allow motion of the heat sink in X and Y directions while constraining motion in a Z direction;
- wherein each ball bearing is positioned at corner sidewalls of the heat sink, such that force applied to the ball bearing from the heat sink will prevent mechanical movement of the heat sink in a vertical direction;
- and
- a plurality of braces for attaching the ball bearings to vertical limit stops, wherein said ball bearings can rotate within the braces.
1 more element
Dependencies are inferred from the claim text.