Bare die package with displacement constraint
AssigneeIntel Corporation
InventorRobert R Atkinson, Jr.
Life of this patent
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Abstract
Embodiments of the present invention describe a bare die package and its methods of fabrication. The bare die package comprises a die electrically coupled to a package substrate, and a displacement constraint. In an embodiment of the present invention, the displacement constraint is a plurality of members fixedly attached onto the package substrate and surrounds the die. When the bare die package is secured between a socket and a heat sink, the plurality of members provide structural support to the package substrate and prevent excessive substrate warpage.
Claims16
A semiconductor assembly comprising:
- a package substrate having a top surface and a bottom surface;
- a die having a front side, a back side, and a periphery formed therebetween, wherein the front side of the die is electrically coupled to the to surface of the package substrate;
- and
- a plurality of members disposed around the periphery of the die, wherein each of the plurality of embers includes a to surface and a bottom surface disposed on the top surface of the package substrate, wherein the plurality of members comprises a plurality of first members having a first size and a plurality of second members having a second size, and wherein the bottom surface of each of the plurality of members is fixedly attached to the top surface of the package substrate.
A semiconductor assembly comprising:
- a package substrate having a top surface and a bottom surface;
- a die having a front side, a back side, and a periphery formed therebetween, wherein the front side of the die is electrically coupled to the top surface of the package substrate;
- a plurality of members disposed around the periphery of the die, wherein each of the plurality of members includes a top surface and a bottom surface disposed on the top surface of the package substrate, wherein the plurality of members comprises a plurality of first members having a first size and a plurality of second members having a second size;
- and
- a heat sink having a planar bottom surface disposed on the back side of the die and on the top surface of each of the plurality of members.
Dependencies are inferred from the claim text.