Transfer material used for producing a wiring substrate

A transfer material having a layer to be transferred to an substrate, the transfer material comprising:

• at least three layers of a first metal layer as a carrier, a second metal layer as a wiring pattern, and a peel layer that is provided between the first metal layer and the second metal layer and temporarily adheres the first metal layer to the second metal layer;
• and
• a circuit component that is formed on the first metal layer by a printing method for electrically connecting to the second metal layer,
• wherein the peel layer is a layer that temporarily adheres the first metal layer to the second metal layer during a time period from a time when the peel layer is formed on the first metal layer up to a time when the second metal layer and the circuit component are transferred to the substrate.