Micro-layered lead frame semiconductor packages
AssigneeFairchild Semiconductor Corporation
InventorsManolito Galera, Leocadio Morona Alabin
Life of this patent
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Abstract
Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a lead frame with a customized array of lands at the bottom of the package. The lands are connected to a series of leads that are located within the perimeter of the lands. The leads can be routed according to the requirements of each specific IC die which they support and therefore can support both a single die and multiple die in the semiconductor package. Such a configuration provides a flexible routing for optimized layout, a maximized package density, and a higher input/output capability with a smaller package size. Other embodiments are also described.
Claims20
A semiconductor package, comprising:
- a lead frame comprising an array of lands which are not physically connected to each other;
- an array of vias connecting the array of lands to an array of leads;
- a die containing an integrated circuit resting on a first portion of the lead array and electrically connected to a second portion of the lead array by wire bonds;
- and
- a molding material encapsulating the vias, the leads, the die, and the wire bonds.
A method for making semiconductor package, comprising:
- providing a lead frame comprising an array of lands which are not physically connected to each other;
- providing an array of vias connecting the array of lands to an array of leads;
- providing a die containing an integrated circuit resting on a first portion of the lead array and electrically connected to a second portion of the lead array;
- and
- providing a molding material encapsulating the vias, the leads, the die, and the wire bonds.
A method for making semiconductor package, comprising:
- providing a lead frame containing an array of vias;
- providing a pre-mold layer around the vias and a metal cladding layer on the upper surfaces of the vias;
- etching the metal cladding layer to provide a series of leads;
- etching the lead frame to form an array of lands which are not physically connected to each other;
- attaching a die containing an integrated circuit device to a first portion of the leads;
- electrically connecting a second portion of the leads and the integrated circuit device;
- and
- encapsulating the leads, the die, and the wire bonds with a molding material.
Dependencies are inferred from the claim text.