Solid state imaging device and method for manufacturing same, and solid state imaging module

A solid state imaging module comprising:

• a solid state imaging device including
• an imaging device substrate with an imaging device section formed on a first major surface side thereof,
• a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface,
• a circuit substrate provided with a circuit substrate electrode opposed to the second major surface,
• a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode, and
• a light shielding layer provided on the circuit substrate side of the backside interconnect electrode and configured to shield light passing though a gap between the imaging device substrate and the circuit substrate;
• a lens provided on the first major surface side of the solid state imaging device and opposed to the imaging device section;
• and
• a supporting component holding the lens and fixing the lens to the solid state imaging device.

A solid state imaging device comprising:

• an imaging device substrate with an imaging device section formed on a first major surface side thereof;
• a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface;
• a circuit substrate provided with a circuit substrate electrode opposed to the second major surface;
• a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode;
• and
• a light shielding layer provided coplanar with the backside interconnect electrode and configured to shield light passing though a gap between the imaging device substrate and the circuit substrate.

A solid state imaging module comprising:

• a solid state imaging device including
• an imaging device substrate with an imaging device section formed on a first major surface side thereof,
• a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface,
• a circuit substrate provided with a circuit substrate electrode opposed to the second major surface,
• a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode, and
• a light shielding layer provided coplanar with the backside interconnect electrode and configured to shield light passing though a gap between the imaging device substrate and the circuit substrate;
• a lens provided on the first major surface side of the solid state imaging device and opposed to the imaging device section;
• and
• a supporting component holding the lens and fixing the lens to the solid state imaging device.