Light emitting package and light emitting package array
AssigneeSamsung LED Co., Ltd.
InventorsHyung-kun Kim, Yu-sik Kim
Life of this patent
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Abstract
Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
Claims17
A light emitting package comprising:
- a light emitting device;
- a package body including a cavity in which the light emitting device is mounted, wherein the cavity includes at least one side and bottom surface;
- a first electrode including a protrusion protruding outwardly from one side of the package body, the protrusion is formed integrally with the package body;
- and
- a second electrode coupled with the package body, the second electrode including a first end portion exposed through the other side of the package body and a second end portion exposed through the bottom or side surface of the cavity and electrically connected to the light emitting device,
- wherein the first electrode is coupled to a second electrode of another light emitting package by inserting the protrusion of the first electrode into the electrode groove of the second electrode of another light emitting package, thereby forming an array of light emitting device packages.
Dependencies are inferred from the claim text.