Thermal management for LED
AssigneeBridgelux, Inc.
InventorWei Shi
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Abstract
A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.
Claims13
An LED assembly comprising:
- at least one LED device;
- an interposer to which the LED device(s) are attached via a top of the LED device(s);
- and
- a passivation layer formed on the top of the LED devices and wherein the LED devices are attached to the interposer by soldering the passivation layer of the LED devices to the interposer.
An LED assembly comprising:
- at least one LED device;
- an interposer to which the LED device(s) are attached via a top of the LED device(s);
- and
- electrical contacts formed on sides of the LED devices and wherein the LED devices are attached to the interposer by soldering the electrical contacts of the LED devices to the interposer.
An LED assembly comprising:
- at least one LED device;
- and
- an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the interposer comprises at least one opening formed therein for receiving an LED device and further comprising at least one spring formed proximate the opening(s) for facilitating attachment of the LED device(s) to the interposer.
An LED assembly comprising:
- at least one LED device;
- and
- an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the interposer comprises at least one opening formed therein for receiving an LED device and further comprising at least one conductive spring formed proximate the opening(s) for facilitating attachment of the LED device(s) to the interposer and for facilitating electrical contact between the LED device(s) and the interposer.
An LED assembly comprising:
- a plurality of LED device(s);
- and
- an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the plurality of LED device(s) are attached to the interposer via a top and sides of the LED devices.
An LED assembly comprising:
- at least one LED device;
- an interposer to which the LED device(s) are attached via a top of the LED device(s);
- and
- a thermally conductive material attached to the top of the LED device(s) and wherein the LED device(s) are attached to the interposer via the thermally conductive material.
An LED device comprising a substrate and an active area, the substrate and the active area defining a top and two sides of the LED device, wherein the LED device is configured to attach to an interposer at the top and the sides of the LED device.
An interposer comprising:
- a thermally conductive substrate;
- at least one opening formed in the substrate, the opening being configured to receive and attach at least one LED device;
- and
- at least one spring configured to enhance attachment of the LED device to the interposer.
Dependencies are inferred from the claim text.