Thin film circuit board device

A thin film circuit board device comprising:

• a first thin film circuit board having a first protrusion provided with a first conductive contact;
• a second thin film circuit board having a second protrusion provided with a second conductive contact;
• and
• an insulator film disposed between said first and second thin film circuit boards;
• wherein said first and second protrusions are disposed one above the other, said insulator film is free of a portion that extends between said first and second protrusions, and said first and second protrusions are folded together in such a manner that said first and second conductive contacts are brought into contact with each other at the fold thereof;
• wherein each of said first and second thin film circuit boards and said insulator film is formed with a through-hole, each of said first and second protrusions protruding from a periphery of said through-hole in a respective one of said first and second thin film circuit boards into said through-hole in the respective one of said first and second thin film circuit boards, said through-hole in said first thin film circuit board being aligned with said through-hole in said second thin film circuit board and said through-hole in said insulator film.