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US 7,888,606 B2Granted
Multilayer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
Life of this patent
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Abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.
Claims18
A printed circuit board comprising:
- a core substrate;
- an electronic device provided in the core substrate and having an electrode pad formed thereon;
- a passivation layer formed on the electronic device and on a first portion of a planar surface of said electrode pad;
- an intermediate layer formed directly on the electrode pad and on the passivation layer, the surface of the intermediate layer being larger than the surface of the electrode pad, and the intermediate layer comprising:
- a first metal layer formed directly on a second portion of the planar surface of said electrode pad where said passivation layer is not formed,
- a second metal layer formed directly on the first metal layer such that surfaces of the first and second metal layer which are directly opposed to each other are in continuous contact, and
- a third metal layer formed directly on the second metal layer such that surfaces of the second and third metal layers which are directly opposed to each other are in continuous contact;
- a first interlayer insulating layer formed over the core substrate and the electronic device and having a first via hole opening therein;
- a first via hole structure formed in the first via hole opening of the interlayer insulating layer, wherein the intermediate layer establishes an electrical connection between the first via hole structure in the interlayer insulating layer and the electrode pad of the electronic device;
- a second interlayer insulating layer formed over the first interlayer insulating layer and the first via hole structure and having a second via hole opening therein;
- and
- a second via hole structure formed in the second via hole opening of the second interlayer insulating layer and electrically connected to the first via hole structure.
9 more elements
An electronic device comprising:
- an electrode pad formed on a surface of the electronic device;
- a passivation layer formed on the surface of the electronic device and on a first portion of a planar surface of said electrode pad;
- and
- an intermediate layer formed directly on the planar surface of the electrode pad and on the passivation layer, and the intermediate layer comprising:
- a first metal layer formed directly on a second portion of the planar surface of said electrode pad where said passivation layer is not formed,
- a second metal layer formed directly on the first metal layer such that surfaces of the first and second metal layer which are directly opposed to each other are in continuous contact, and
- a third metal layer formed directly on the second metal layer such that surfaces of the first and second metal layer which are directly opposed to each other are in continuous contact;
- wherein when the electronic device is provided in a core substrate of a printed circuit board, the intermediate layer establishes an electrical connection between a first via hole structure provided by a conductive material provided within a first via hole opening in a first interlayer insulating layer of the printed circuit board and the electronic pad of the electronic device, the first via hole structure being electrically connected to a second via hole structure formed by a second interlayer insulating layer formed over the first interlayer insulating layer and the first via hole structure and having a second via hole opening therein and a second via hole structure formed in the second via hole opening.
5 more elements
Dependencies are inferred from the claim text.