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US 7,888,604 B2Granted
Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
Assignee3M Innovative Properties Company
InventorsKohichiro Kawate, Andrew C. Lottes, James G. Vana, Jr., Barbara L. Birrell, Alexander W. Barr
Life of this patent
Estimating the term…
Abstract
Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.
Claims13
An article comprising:
- a flexible substrate having at least one conductive trace on its surface extending from a first end to a second end of the substrate, wherein said at least one conductive trace is configured to form an electrical connection between a first circuit to be connected at the first end of the substrate and a second circuit to be connected at the second end of the substrate, wherein one or both of the first and second ends of the at least one conductive trace are embossed;
- and
- a heat-curable adhesive on the first and second ends of the substrate wherein the adhesive comprises conductive particles.
Dependencies are inferred from the claim text.