Printed circuit board having air vent for molding and package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorSung-Yong Park
Life of this patent
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Abstract
Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, a molding region on which at least one semiconductor chip is mounted and for which a molding for the semiconductor chip is performed, and a plurality of air vents extending towards edges of the printed circuit board from the molding region.
Claims18
A printed circuit board that comprises a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, the printed circuit board comprising:
- a molding region, the molding region configured to receive at least one semiconductor chip and an encapsulant covering the at least one semiconductor chip;
- a plurality of air vents extending to edges of the printed circuit board from the molding region;
- and
- at least one dummy pattern disposed along the air vents.
A printed circuit board, comprising:
- a substrate layer including a circuit pattern;
- a first protection layer disposed on an upper surface of the substrate layer and defining an air vent;
- a second protection layer disposed on a lower surface of the substrate layer;
- a plurality of connection terminals disposed in the first protection layer of the printed circuit board;
- and
- at least one dummy pattern disposed in the substrate layer.
Dependencies are inferred from the claim text.