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US 7,888,599 B2Granted
Printed circuit board including embedded capacitor and method of fabricating same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Woo Kim, Byoung Youl Min, Chang Myung Ryu, Woo Lim Chae, Han Kim
Life of this patent
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Abstract
Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
Claims3
A method of fabricating a printed circuit board including an embedded capacitor, comprising the steps of:
- (A) forming an opening through a copper clad laminate so that the opening is formed through upper and lower copper foil layers of the copper clad laminate and has a predetermined length;
- (B) forming first copper layers on the upper and lower copper foil layers of the copper clad laminate and on walls of the opening;
- (C) packing a high dielectric material in the opening, on the walls of which the first copper plating layers have already been formed;
- (D) forming second copper plating layers on the first copper plating and on the high dielectric material;
- and
- (E) partially etching the upper and lower copper foil layers, and the first and second copper plating layers in such a way that first and second electrodes are formed so as to extend along both longitudinal walls of a structure, which consists of the high dielectric material, to be in contact with the structure.
3 more elements
Dependencies are inferred from the claim text.