Aromatic polyamide and epoxy group-containing phenoxy resin
AssigneesNitto Shinko Corporation, E. I. Du Pont de Nemours and Company, Dupont Teijin Advanced Papers (Japan), Ltd.
InventorsYasuyuki Kihara, Yoshiki Takahashi, Hidenori Takayama, Masanori Imai, Yasunori Tanaka, Shinji Naruse, David Wayne Anderson
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Abstract
A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
Claims4
A polyamide resin composition comprising an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, the content of the epoxy group-containing phenoxy resin being 30 to 50% by mass.
Dependencies are inferred from the claim text.