US 7,888,411 B2Granted

Thermally conductive adhesive composition and process for device attachment

AssigneeCreative Electron, Inc.

InventorsMatthew Wrosch, Miguel Albert Capote, Alan Grieve

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Abstract

A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Claims12

Dependent claims

A thermally conductive adhesive composition comprising:

a powder of a high melting point metal or metal alloy;
a powder of a low melting point metal or metal alloy;
and
a polymerizable fluxing polymer matrix composition comprising a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride, wherein the polymerizable fluxing polymer matrix composition further comprises:
a polymer diluent with at least one carbon carbon double bond;
and
a polymer diluent with at least one functional hydroxyl group comprising at least one material selected from the group consisting of:
triethylene glycol, glycerol, tri(propylene glycol) methyl ether and di(ethylene glycol) butyl ether,
wherein the ratio by weight of the powder of the low melting point metal or metal alloy to the powder of the high melting point metal or metal alloy ranges from about 0.50 to about 0.80.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/071,280Filed 19 Feb 2008 · continuation in part
Priority: 1 Apr 2003
Published: US 2008/0207814 A128 Aug 2008
Granted: 15 Feb 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

C08F 220/26
Esters: esters containing oxygen in addition to the carboxy oxygen
C09J 4/00
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon
C09J 9/00
Adhesives characterised by their physical nature or the effects produced
C09J 11/04
Non-macromolecular additives: inorganic

Family

Application60/458,944Us provisional application · filed 1 Apr 2003
PCT/US2004/009886Parent of this continuation-in-part · filed 30 Mar 2004
Application60/902,057Us provisional application · filed 20 Feb 2007
US 2008/0207814 A1Pre-grant publication · published 28 Aug 2008
Application10/550,408Parent of this continuation-in-part
US 2006/0194920 A1Published application
US 7,888,411 B2This patent

From the US filing history. Foreign family members aren’t listed.