Aqueous based residue removers comprising fluoride
AssigneeAir Products and Chemicals, Inc.
InventorsAiping Wu, Roberto John Rovito
Life of this patent
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Abstract
A composition and method comprising same for selectively removing residues such as, for example, ashed photoresist and/or processing residues are disclosed herein. In one aspect, there is provided a composition for removing residue wherein the composition has a pH ranging from about 2 to about 9 comprising: a buffer solution comprising an organic acid and a conjugate base of the organic acid in a molar ratio of acid to base ranging from 10:1 to 1:10; a fluoride, and water, provided that the composition is substantially free of an added organic solvent. In another aspect, the composition may further comprise a corrosion inhibitor and/or a surfactant.
Claims18
A composition for removing residue wherein the composition has a pH ranging from about 2 to about 9, the composition comprising:
- a buffer solution comprising an acid and a conjugate base of the acid in a molar ratio of acid to base ranging from 10:1 to 1:10 and wherein the acid is at least one selected from acetic acid, phosphoric acid, benzoic acid, phenolic acid, and mixtures thereof and wherein the conjugate base of the acid is at least one selected from ammonium acetate, an ammonium salt of phosphoric acid, a benzoic salt, a phenolate salt, and mixtures thereof;
- a fluoride, and
- water,
- provided that the composition is substantially free of an added organic solvent.
A method for defining a pattern comprising:
- coating a photoresist onto at least a portion of the substrate;
- lithographically defining a pattern on the photoresist;
- transferring the pattern onto at least a portion of the substrate;
- etching the pattern into the substrate to form a patterned substrate
- heating the patterned substrate to a temperature sufficient to ash the photoresist and provide a residue;
- and
- removing the residue by contacting the patterned substrate with a composition comprising:
- an buffer solution comprising an organic acid and a conjugate base of the organic acid in a molar ratio of acid to conjugate base ranging from 10:1 to 1:10;
- a fluoride;
- and water, wherein the composition has a pH ranging from about 2 to about 9 and the composition is substantially free of an added organic solvent.
A composition for removing residue wherein the composition has a pH ranging from about 2 to about 9, the composition comprising:
- a buffer solution comprising an organic acid and a conjugate base of the organic acid in a molar ratio of acid to base ranging from 10:1 to 1:10;
- a fluoride,
- water,
- a corrosion inhibitor, and
- a surfactant,
- provided that the composition is substantially free of an added organic solvent.
A composition for removing residue wherein the composition has a pH ranging from about 2 to about 9, the composition comprising:
- a buffer solution comprising acetic acid and ammonium acetate in a molar ratio of acid to base ranging from 10:1 to 1:10;
- ammonium fluoride,
- water,
- a corrosion inhibitor comprising citric acid, and
- an ethoxylated acetylenic diol surfactant,
- provided that the composition is substantially free of an added organic solvent.
A composition for removing residue wherein the composition has a pH ranging from about 2 to 7, the composition comprising:
- a buffer solution comprising an organic acid and a conjugate base of the organic acid in a molar ratio of acid to base ranging from 10:1 to 1:10;
- a fluoride, and
- 80% by weight or greater of water,
- provided that the composition is substantially free of an added organic solvent.
Dependencies are inferred from the claim text.