Method of forming polycrystalline semiconductor film

A method of forming a polycrystalline semiconductor film, comprising:

• irradiating an amorphous semiconductor film formed on an insulating substrate with light to convert the amorphous semiconductor into a laterally grown polycrystalline semiconductor to form a polycrystalline semiconductor film, wherein
• the irradiating step comprises controlling crystal growth in the amorphous semiconductor such that, on an X-axis and a Y-axis which are set with respect to a surface of the amorphous semiconductor film and which are orthogonal to each other, first crystal grains laterally grow in a first direction along the X-axis from a first group of initial nuclei, second crystal grains laterally grow in a second direction opposite to the first direction along the X-axis from a second group of initial nuclei arranged apart from the first group of initial nuclei along the X-axis, and the first crystal grains collide against the second crystal grains at different points in time along the Y-axis,
• the light with which the amorphous semiconductor is irradiated, exhibits an intensity distribution varying in V shape along the X-axis and having a gradient of cyclic increases and decreases along the Y-axis, and is formed by a light modulating element, and
• the light modulating element has a basic pattern in which elongate band-like areas containing a plurality of unit areas arranged along the Y-axis and extending along the Y-axis are repeatedly arranged along the X-axis, and in each of the band-like areas, a ratio of the first area having the first phase value to the second area having the second phase value varies with the unit area along the X-axis, and a change rate of an occupied area rate of the first area in each unit area increases and decreases in the Y-axis for each band-like area.

A method of manufacturing a thin-film semiconductor device, comprising:

• forming an amorphous semiconductor film on an insulating substrate;
• irradiating the amorphous semiconductor film with light to convert the amorphous semiconductor into a polycrystalline semiconductor with laterally grown crystal grains to form a polycrystalline semiconductor film
• such that, on an X-axis and a Y-axis which are set with respect to a surface of the amorphous semiconductor film and which are orthogonal to each other, first crystal grains laterally grow in a first direction along the X-axis from a first group of initial nuclei on a first straight line extending along the Y-axis, second crystal grains laterally grow in a second direction opposite to the first direction along the X-axis from a second group of initial nuclei arranged on a second straight line extending along the Y-axis and apart from the first group of initial nuclei along the X-axis and the first straight line, the first crystal grains collide against the second crystal grains at different points in time along the Y-axis, and growing speeds of the first crystal grains and the second crystal grains vary between predetermined points along the Y-axis;
• and
• forming a plurality of thin-film transistors each having the polycrystalline semiconductor film as an active layer.

A method of manufacturing a thin-film semiconductor device, comprising:

• forming an amorphous semiconductor film on an insulating substrate;
• irradiating the amorphous semiconductor film with light to convert the amorphous semiconductor into a polycrystalline semiconductor with laterally grown crystal grains to form a polycrystalline semiconductor film such that, on an X-axis and a Y-axis which are set with respect to a surface of the amorphous semiconductor film and which are orthogonal to each other, first crystal grains laterally grow in a first direction along the X-axis from a first group of initial nuclei, second crystal grains laterally grow in a second direction opposite to the first direction along the X-axis from a second group of initial nuclei arranged apart from the first group of initial nuclei along the X-axis, and the first crystal grains collide against the second crystal grains at different points in time along the Y-axis;
• and
• forming a plurality of thin-film transistors each having the polycrystalline semiconductor film as an active layer, wherein
• the light with which the amorphous semiconductor is irradiated, exhibits an intensity distribution varying in V shape along the X-axis and having a gradient that increases and decreases along the Y-axis, and is formed by a light modulating element, and
• the light modulating element has a basic pattern in which elongate band-like areas containing a plurality of unit areas arranged along the Y-axis and extending along the Y-axis are repeatedly arranged along the X-axis, and in each of the band-like areas, a ratio of the first area having the first phase value to the second area having the second phase value varies with the unit area along the X-axis, and a change rate of an occupied area rate of the first area in each unit area increases and decreases in the Y-axis for each band-like area.

A method of manufacturing a thin-film semiconductor device, comprising:

• forming an amorphous semiconductor film on an insulating substrate;
• irradiating the amorphous semiconductor film with light to convert the amorphous semiconductor into a polycrystalline semiconductor with laterally grown crystal grains to form a polycrystalline semiconductor film such that, on an X-axis and a Y-axis which are set with respect to a surface of the amorphous semiconductor film and which are orthogonal to each other, first crystal grains laterally grow in a first direction along the X-axis from a first group of initial nuclei, second crystal grains laterally grow in a second direction opposite to the first direction along the X-axis from a second group of initial nuclei arranged apart from the first group of initial nuclei along the X-axis, and the first crystal grains collide against the second crystal grains at different points in time along the Y-axis;
• and
• forming a plurality of thin-film transistors each having the polycrystalline semiconductor film as an active layer,
• wherein the first crystal grains and the second crystal grains grow laterally along the X-axis and collide against one another, and after the collision, the crystal growth in an area in which the collision occurs earlier than in an adjacent area along the Y-axis progresses to the adjacent area along the Y-axis in which the crystal growth has not started yet, and a plurality of isolated dot-like nodules are finally formed, and
• wherein a sum of size φ of each of the dot-like nodules and an interval S between the adjacent dot-like projections is smaller than a minimum design rule Dm between the plurality of thin-film transistors.