Integrated circuit inductor with integrated vias

A method of forming an integrated circuit inductor, comprising:

• providing a semiconductor;
• forming a first metal layer of a first length above said semiconductor;
• forming a second metal layer of a second length above said first metal layer;
• forming a continuous via of a third length interconnecting said first metal layer and said second metal layer to form an integrated circuit inductor wherein said third length is greater than three percent but less than all of said first length;
• said first and second metal layers being defined by respective substantially planar surfaces configured in superposed spiral loops having first and second adjacent lead ends, and each spiral loop including a plurality of concentric symmetric turns connected by metal cross-over portions located at central portions of the spiral loops opposite the lead ends.