Method for manufacturing electronic device

A method for manufacturing an electronic device comprising a plurality of lead frames individually supporting an electronic component surrounded by a casing, the method comprising steps of:

• charging a first resin into each casing on a base on which the plurality of lead frames are formed by:
• using a mask having through-holes in positions corresponding to regions surrounded by the casings;
• and
• positioning the mask in such a manner that the through-holes of the mask are positioned to correspond to the regions surrounded by the casings;
• curing the first resin;
• positioning a second resin on the surface of the first resin, using a mask having through-holes in positions corresponding to the regions surrounded by the casings;
• and
• cutting the base to separate the lead frames into individual lead frames.

A method for manufacturing an electronic device comprising a plurality of lead frames for individually supporting an electronic component surrounded by a casing, the method comprising steps of:

• charging a first resin into the casing of each of the plurality of lead frames held by a holder by:
• using a mask having through-holes in positions corresponding to regions surrounded by the casings;
• positioning the mask in such a manner that the through-holes of the mask are positioned to correspond to the regions surrounded by the casings;
• moving a first squeegee along a surface of the mask to charge the first resin into the regions via the through-holes of the mask;
• and
• moving a second squeegee along the surface of the mask while pressing the second squeegee against the surface to remove any excess portion of the first resin, thereby making a surface of the first resin flat;
• and
• detaching each of the lead frames from the holder.

A method for manufacturing an electronic device comprising a plurality of lead frames for individually supporting an electronic component surrounded by a casing, the method comprising steps of:

• charging a first resin into the casing of each of the plurality of lead frames held by a holder by:
• using a mask having through-holes in positions corresponding to regions surrounded by the casings;
• and
• positioning the mask in such a manner that the through-holes of the mask are positioned to correspond to the regions surrounded by the casings;
• curing the first resin;
• and
• positioning a second resin on the surface of the first resin, using a mask having through-holes in positions corresponding to regions surrounded by the casings.