Method of fabicating a microelectronic die having a curved surface
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy
Life of this patent
Estimating the term…
Abstract
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
Claims25
A method for manufacturing a microelectronic device, the method comprising:
- attaching a microelectronic die to a support member, the microelectronic die having a first side facing the support member and a second side opposite the first side;
- placing a stress material onto the second side of the microelectronic die;
- curing the stress material placed onto the second side of the microelectronic die, thereby inducing an internal strain in the stress material that bends the microelectronic die;
- and
- encapsulating at least a portion of the support member, the stress material, and the bent microelectronic die with an encapsulant.
A method for manufacturing a microelectronic device, the method comprising:
- mounting a processor or memory die to a support member, the processor or memory die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit, the processor or memory die having a first side facing the support member and a second side opposite the first side;
- electrically coupling the terminals of the processor or memory die to the support member;
- placing a stress material onto the second side of the processor or memory die;
- curing the stress material placed onto the second side of the processor or memory die, thereby inducing an internal strain in the stress material that flexes the processor or memory die such that the die has a curved surface;
- and
- encapsulating at least a portion of the flexed processor or memory die, the stress material, and the support member with a casing.
A method for manufacturing a microelectronic device, the method comprising:
- attaching a microelectronic die to a support member, the microelectronic die having a first side facing the support member and a second side opposite the first side;
- placing a stress material onto the second side of the microelectronic die;
- inducing an internal strain in the stress material on the second side of the microelectronic die, the internal strain in the stress material flexing the microelectronic die;
- and
- encapsulating at least a portion of the support member, the stress material, and the flexed microelectronic die with an encapsulant.
Dependencies are inferred from the claim text.