Method for assembling stackable semiconductor packages
AssigneeFreescale Semiconductor, Inc.
InventorsZhigang Bai, Weimin Chen, Zhijie Wang
Life of this patent
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Abstract
A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.
Claims14
A method for assembling a stackable semiconductor package, comprising:
- providing a substrate having a first surface and a second surface, wherein the first surface comprises a plurality of bond pads and one or more die pads for attaching one or more semiconductor dies;
- attaching the one or more semiconductor dies on the one or more die pads;
- forming a plurality of conductive bumps on the plurality of bond pads;
- placing the substrate in a side-gate molding cast, such that the molding cast surrounds the first surface of the substrate, the one or more semiconductor dies and the plurality of conductive bumps;
- and
- supplying a mold material to the first surface of the substrate via side-gates of the molding cast, wherein the mold material covers the one or more semiconductor dies and at least partially covers the plurality of conductive bumps, wherein a portion of each of the plurality of conductive bumps is exposed for providing electrical connection to a second semiconductor package,
- whereby, a first semiconductor package comprising a first boundary layer and a second boundary layer is formed, the first boundary layer being delineated by a first surface of the mold material and the exposed portion of the plurality of conductive bumps and the second boundary layer being delineated by the second surface of the substrate.
A system for assembling a stackable semiconductor package, comprising:
- a platform for holding a substrate, the substrate having a first surface and a second surface, wherein the first surface comprises a plurality of bond pads and one or more die pads for attaching one or more semiconductor dies;
- means for forming a plurality of conductive bumps on the plurality of bond pads on the first surface of the substrate;
- means for attaching the one or more semiconductor dies on the one or more die pads on the first surface of the substrate;
- a side-gate molding cast for receiving the substrate, wherein the molding cast covers the first surface of the substrate, the one or more semiconductor dies and the plurality of conductive bumps;
- and
- means for supplying a mold material to the first surface of the substrate by way of the side-gates, wherein the mold material completely covers the one or more semiconductor dies and partially covers the plurality of conductive bumps, wherein a portion of each of the plurality of conductive bumps is exposed for providing electrical connection to a second semiconductor package,
- whereby, a semiconductor package comprising a first boundary layer and a second boundary layer is formed, the first boundary layer being delineated by a first surface of the mold material and the exposed portion of the plurality of conductive bumps and the second boundary layer being delineated by the second surface of the substrate.
Dependencies are inferred from the claim text.