Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

A semiconductor device assembly comprising:

• a first semiconductor device having a first major surface, an opposing second major surface, and at least one conductive element on or in at least one of the first major surface or the second major surface thereof;
• at least a second semiconductor device situated at least partially over the first major surface or the second major surface of the first semiconductor device, the second semiconductor device having a first major surface, an opposing second major surface, and at least one conductive element on or in at least one of the first major surface and the second major surface thereof;
• a first conductive pathway having a first end disposed over the first major surface of the first semiconductor device and a second end disposed over the second major surface of the first semiconductor device, the first conductive pathway extending around a side of the first semiconductor device, the at least one conductive element of the first semiconductor device being electrically coupled to the first end or the second end of the first conductive pathway;
• at least a second conductive pathway communicating electrically with the first conductive pathway and having a first end disposed adjacent the first end of the first conductive pathway and a second end disposed over the first major surface or the second major surface of the second semiconductor device, the second conductive pathway extending around a side of the first semiconductor device and a side of the second semiconductor device, the at least one conductive element of the second semiconductor device being electrically coupled to the first conductive pathway or the second conductive pathway, wherein the first conductive pathway and the second conductive pathway each comprise a conductive trace carried by a carrier substrate and the carrier substrate comprises a flexible dielectric material;
• and
• a conductive via extending through the conductive trace and the carrier substrate of the first conductive pathway and the second conductive pathway.

A system comprising at least one electronic signal processor configured to communicate with at least one memory device, wherein at least one of the at least one signal processor and the at least one memory device comprises a semiconductor device assembly comprising:

• a plurality of semiconductor devices stacked one over another comprising:
• a first semiconductor device comprising a first major surface, an opposing second major surface, and at least one conductive element on or in at least the first major surface thereof;
• and
• a second semiconductor device situated at least partially over the first major surface or the second major surface of the first semiconductor device, the second semiconductor device comprising a first major surface, an opposing second major surface, and at least one conductive element on or in at least the first major surface thereof;
• and
• at least three self-supporting conductive leads, each comprising a first end and a second end, the first ends of the at least three self-supporting conductive leads being structurally and electrically coupled together and extending over one of the first major surface and the second major surface of the first semiconductor device, each of the at least three self-supporting conductive leads extending around a side of the first semiconductor device, the second ends of the at least three self-supporting conductive leads extending over a major surface of a semiconductor device of the plurality of semiconductor devices, and the second ends of the at least three self-supporting conductive leads being structurally and electrically coupled to a conductive element of a semiconductor device of the plurality of semiconductor devices.