Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon, Jong-Woo Ha
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
Claims10
A method of manufacture of an integrated circuit packaging system comprising:
- providing a shaped platform with a conductive post;
- mounting the shaped platform with the conductive post over a temporary carrier;
- mounting an integrated circuit device over the temporary carrier;
- encapsulating the conductive post and the integrated circuit device leaving a first end of the conductive post exposed from the encapsulation;
- removing a portion of the shaped platform forming at least two discrete conductive post whereby the conductive post extends through the encapsulant and a second end of the conductive post is exposed from the encapsulant;
- and
- removing the temporary carrier.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a temporary carrier with an adhesive layer;
- mounting a shaped platform with a conductive post on the adhesive layer;
- mounting an integrated circuit device with an active side on the adhesive layer adjacent the conductive post;
- encapsulating the conductive post and the integrated circuit device leaving a first end of the conductive post exposed from the encapsulation;
- removing the shaped platform from the conductive post whereby the conductive post extends through the encapsulant and a second end of the conductive post is exposed from the encapsulant;
- and
- removing the temporary carrier and the adhesive layer.
Dependencies are inferred from the claim text.