Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die

A method of making a semiconductor device, comprising:

• providing a substrate for supporting the semiconductor device;
• connecting a solder bump to the substrate;
• mounting a semiconductor die to the substrate, the semiconductor die having a contact pad formed over a surface of the semiconductor die;
• depositing encapsulant over the solder bump and the semiconductor die;
• etching the encapsulant to expose the contact pad of the semiconductor die;
• forming a first redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the solder bump;
• and
• removing the substrate to expose a bottom surface of the solder bump.

A method of making a semiconductor device, comprising:

• providing a substrate for supporting the semiconductor device;
• connecting a conductive bump to the substrate;
• mounting a semiconductor die to the substrate;
• depositing encapsulant over the conductive bump and the semiconductor die;
• removing a portion of the encapsulant to expose a contact pad of the semiconductor die;
• forming a redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the conductive bump;
• and
• removing the substrate to expose a bottom surface of the conductive bump.

A method of making a semiconductor device, comprising:

• providing a substrate for supporting the semiconductor device;
• forming a bump over the substrate;
• mounting a semiconductor die to the substrate;
• depositing an encapsulant over the bump and semiconductor die;
• removing a portion of the encapsulant to expose a contact pad of the semiconductor die;
• forming a redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the bump;
• and
• removing the substrate to expose a bottom surface of the bump.