US 7,888,180 B2 · Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

Abstract

A semiconductor apparatus includes a semiconductor device having electrodes on its opposed frontside and backside, respectively, a first external electrode connected to the electrode at the frontside, the first external electrode having a first major surface generally parallel to the frontside of the semiconductor device, and a first side surface generally perpendicular to the first major surface, and a second external electrode having a second major surface generally parallel to the backside of the semiconductor device, a second side surface generally perpendicular to the second major surface, and a projection protruding perpendicular to the second major surface and connected to the electrode at the backside, The first side surface of the first external electrode and the second side surface of the second external electrode serve as mount surfaces. The semiconductor device is located between the first external electrode and the second external electrode.

Claims20

Dependent claims

A method for manufacturing semiconductor apparatus comprising:

forming first projections made of conductive material on each electrode of one semiconductor device for each of a plurality of semiconductor devices, the electrode being formed on a front surface of a semiconductor wafer;
forming a first groove between the semiconductor devices on the front surface of the semiconductor wafer;
forming a first sealing portion by filling the first groove and a gap between the first projections with insulating material;
polishing a back surface of the semiconductor wafer;
forming second projections made of conductive material on the back surface of the semiconductor wafer, the second projections being connected to the semiconductor device;
forming a second sealing portion by filling a gap between the second projections by insulating material;
forming a first lead made of conductive material on one of the first projections;
forming a second lead made of conductive material on one of the second projections;
and
separating the semiconductor devices by cutting the first and second sealing portions between the semiconductor devices.

7 more elements

A method for manufacturing a semiconductor apparatus, the method comprising:

forming a sealing portion on a side of at least one of a front surface and a back surface of a semiconductor device, the front surface being opposite to the back surface, each of the front surface and the back surface having an electrode;
forming a hole reaching the electrode in the sealing portion;
forming a conductive portion connecting to the electrode in the hole;
and
forming an external electrode at an end face of the sealing portion, the external electrode being connected to the end face of the conductive portion and including a cup shape electrode film extending to a side face of the sealing portion.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

Life of this patent

Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

Life of this patent

Abstract

Claims20