Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

A method of manufacturing a semiconductor device, comprising:

• preparing a wiring motherboard which includes a connection pad on one side and a land electrically connected to said connection pad on the other side;
• a disposition step for dividing said wiring motherboard into a plurality of divided boards, each of which has at least one said wiring board, and for disposing said divided boards to be spaced-apart with each other;
• a chip mounting step for mounting a semiconductor chip onto a plurality of said wiring boards and for mounting said semiconductor chip spanning at least two divided boards;
• an electrical connection step for electrically connecting said connection pads of said wiring board and electrode pads formed on one side of said semiconductor chip;
• a sealing step for forming a sealing part so as to at least cover said semiconductor chip and a semiconductor chip mounting face of said wiring board;
• forming an external terminal in said land;
• and
• obtaining a plurality of semiconductor devices by cutting said sealing part and said divided board.