Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

A method of manufacturing an electronic component, comprising:

• forming a wiring on or above a substrate such that the wiring is electrically connected to a first electrode disposed on a first surface of the substrate;
• forming a first resin layer on or above the substrate such that the wiring is disposed between the substrate and the first resin layer;
• forming an opening in the first resin layer such that the opening overlaps the wiring;
• forming a conductive member in the opening such that the conductive member is electrically connected to the wiring;
• and
• forming a second electrode on the conductive member such that the second electrode is electrically connected to the wiring via the conductive member, a material of the second electrode being different from a material of the conductive member;
• separating the substrate into individual elements after the forming of the first resin layer,
• wherein the wiring is formed to have a portion between the first electrode and the second electrode, the portion having a first portion and a second portion, the first portion extending along a first direction in a plane parallel to the first surface of the semiconductor chip, the second portion extending along a second direction in the plane, the second direction being different from the first direction.