Methods of forming a phase change material
AssigneeMicron Technology, Inc.
InventorKeith R. Hampton
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Abstract
Methods of forming a phase change material are disclosed. The method includes forming a chalcogenide compound on a substrate and simultaneously applying a bias voltage to the substrate to alter the stoichiometry of the chalcogenide compound. In another embodiment, the method includes positioning a substrate and a deposition target having a first stoichiometry in a deposition chamber. A plasma is generated in the deposition chamber to form a phase change material on the substrate. The phase change material has a stoichiometry similar to the first stoichiometry. A bias voltage is applied to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry. A phase change material, a phase change random access memory device, and a semiconductor structure are also disclosed.
Claims20
A method of forming a phase change material, comprising:
- forming a chalcogenide compound on a substrate;
- and
- simultaneously applying a bias voltage to the substrate to alter a stoichiometry of the chalcogenide compound.
A method of forming a phase change material, comprising:
- positioning a substrate and a deposition target in a deposition chamber, the deposition target comprising a first stoichiometry;
- generating a plasma in the deposition chamber;
- forming a phase change material on the substrate, the phase change material comprising a stoichiometry substantially similar to the first stoichiometry of the deposition target;
- and
- applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry.
A method of forming a phase change material, comprising:
- forming a chalcogenide compound on a substrate, the chalcogenide compound comprising a different stoichiometry than a stoichiometry of a deposition target from which the chalcogenide compound is formed.
Dependencies are inferred from the claim text.