Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device comprising:

• forming a separation layer over a substrate;
• forming an element formation layer having a semiconductor integrated circuit and an antenna over the separation layer;
• forming a first organic resin layer so as to cover the element formation layer;
• forming first paste with conductivity over a first surface of the first organic resin layer before the first organic resin layer is cured, the first paste being in a region not overlapping with at least the element formation layer;
• forming a first conductor which reaches a second surface of the first organic resin layer opposite to the first surface of the first organic resin layer from the first surface by curing the first organic resin layer after the first paste is made to penetrate into the first organic resin layer;
• forming a first conductive film over the first organic resin layer so as to be electrically connected to the first conductor and so as to overlap with the element formation layer;
• separating the element formation layer from the substrate to expose the first conductor formed in the first organic resin layer on a separation surface;
• forming a second organic resin layer over the separation surface;
• forming second paste with conductivity over a first surface of the second organic resin layer before the second organic resin layer is cured, the second paste being in a region overlapping with at least the first conductor exposed on the separation surface;
• forming a second conductor which reaches a second surface of the second organic resin layer opposite to the first surface of the second organic resin layer from the first surface and is electrically connected to the first conductor by curing the second organic resin layer after the second paste is made to penetrate into the second organic resin layer;
• and
• forming a second conductive film over the second organic resin layer so as to be electrically connected to the second conductor and so as to overlap with the element formation layer.

A method for manufacturing a semiconductor device comprising:

• forming a separation layer over a substrate;
• forming a first protective film over the separation layer;
• forming an element formation layer having a semiconductor integrated circuit and an antenna over the first protective film;
• forming a second protective film over the element formation layer;
• forming a first organic resin layer so as to cover the second protective film;
• forming first paste with conductivity over a first surface of the first organic resin layer before the first organic resin layer is cured;
• forming a first conductor which reaches a second surface of the first organic resin layer opposite to the first surface of the first organic resin layer from the first surface by curing the first organic resin layer after the first paste is made to penetrate into the first organic resin layer;
• separating the element formation layer from the substrate and selectively removing the first protective film and the second protective film at a separation surface to expose the first conductor formed in the first organic resin layer;
• forming a second organic resin layer over the separation surface;
• forming second paste with conductivity over a first surface of the second organic resin layer before the second organic resin layer is cured;
• and
• forming a second conductor which reaches a second surface of the second organic resin layer opposite to a first surface of the second organic resin layer from the first surface and is electrically connected to the first conductor by curing the second organic resin layer after the second paste is made to penetrate into the second organic resin layer.

A semiconductor device comprising:

• a first organic resin layer and a second organic resin layer which are provided so as to face each other;
• an element formation layer having a semiconductor integrated circuit and an antenna, which is provided between the first organic resin layer and the second organic resin layer;
• a first conductive film provided on a first surface of the first organic resin layer;
• a second conductive film provided on a first surface of the second organic resin layer;
• a first conductor which is electrically connected to the first conductive film and reaches a second surface of the first organic resin layer opposite to the first surface of the first organic resin layer from the first surface;
• and
• a second conductor which is electrically connected to the second conductive film and reaches a second surface of the second organic resin layer opposite to a first surface of the second organic resin layer from the first surface,
• wherein the first organic resin layer includes at least a structure body in which a fibrous body is impregnated with an organic resin,
• wherein the first conductor is provided in the first organic resin layer through space in the fibrous body, and
• wherein the first conductive film and the second conductive film are electrically connected to each other through the first conductor and the second conductor.

A semiconductor device comprising:

• a first organic resin layer and a second organic resin layer which are provided so as to face each other;
• an element formation layer having a semiconductor integrated circuit and an antenna, which is provided between the first organic resin layer and the second organic resin layer;
• a first conductive film provided on a first surface of the first organic resin layer;
• a second conductive film provided on a first surface of the second organic resin layer;
• a first conductor which is electrically connected to the first conductive film and reaches a second surface of the first organic resin layer opposite to the first surface of the first organic resin layer from the first surface;
• and
• a second conductor which is electrically connected to the second conductive film and reaches a second surface of the second organic resin layer opposite to a first surface of the second organic resin layer from the first surface,
• wherein the first organic resin layer includes at least a structure body in which a first fibrous body is impregnated with a first organic resin,
• wherein the first conductor is provided in the first organic resin layer through space in the first fibrous body,
• wherein the second organic resin layer includes at least a structure body in which a second fibrous body is impregnated with a second organic resin,
• wherein the second conductor is provided in the second organic resin layer through space in the second fibrous body, and
• wherein the first conductive film and the second conductive film are electrically connected to each other through the first conductor and the second conductor.