Manufacturing method for semiconductor integrated device

A method for manufacturing a semiconductor integrated circuit device, comprising the steps of:

• (a) providing a plurality of chips affixed to an adhesive tape;
• and
• (b) vacuum-chucking a surface of a first of the chips with a chucking collet, vacuum-chucking the adhesive tape to an upper surface of a lower base, and peeling the adhesive tape from the first chip;
• the step (b) including:
• (b1) moving the chucking collet with the first chip away from the lower base,
• wherein, in step (b1), a bent state of the first chip is monitored based on a measured flow rate of a vacuum system of the chucking collet so as to prevent excessive bending of the first chip before complete separation of the first chip from the adhesive tape.

A method for manufacturing a semiconductor integrated circuit device, comprising the steps of:

• (a) providing a plurality of chips affixed to an adhesive tape;
• and
• (b) vacuum-chucking a surface of a first of the chips with a chucking collet vacuum-chucking the adhesive tape to an upper surface of a lower base, and peeling the adhesive tape from the first chip;
• the step (b) including:
• (b1) moving the chucking collet with the first chip away from the lower base,
• wherein, in step (b1), a bent state of the first chip is monitored based on a measured flow rate of a vacuum system of the chucking collet so as to prevent excessive bending of the first chip before complete separation of the first chip from the adhesive tape, and
• said moving in step (b1) is responsive to the monitored bent state of the first chip such that the bent state remains within an allowable range.

A method for manufacturing a semiconductor integrated circuit device, comprising the steps of:

• (a) providing a plurality of chips affixed to an adhesive tape;
• and
• (b) vacuum-chucking a surface of a first of the chips with a chucking collet vacuum-chucking the adhesive tape to an upper surface of a lower base, and peeling the adhesive tape from the first chip;
• the step (b) including:
• (b1) moving the chucking collet with the first chip away from the lower base,
• wherein, in step (b1), a bent state of the first chip is monitored based on a measured flow rate of a vacuum system of the chucking collet so as to prevent excessive bending of the first chip before complete separation of the first chip from the adhesive tape, and
• the adhesive tape is peeled from the first chip by regulating the moving of the chucking collet in step (b1) based on the monitored bent state of the first chip.