Magnetic self-assembly for integrated circuit packages
AssigneeSensormatic Electronics Corporation
InventorsMing-Ren Lian, Gary Mark Shafer, George A. Reynolds
Life of this patent
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Abstract
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
Claims16
A method of assembling an integrated circuit to a substrate comprising:
- providing a first magnetic material associated with at least one region of said substrate;
- providing an integrated circuit having a second magnetic material associated therewith;
- directing a slurry comprising said integrated circuit and a fluid over said substrate;
- and
- transporting said integrated circuit towards said at least one region of said substrate, whereby said second magnetic material is attracted to said first magnetic material to urge at least a portion of said integrated circuit towards said at least one region.
A method of assembling an integrated circuit package, comprising:
- providing a substrate having circuitry therein:
- providing a first magnetic material associated with at least one region of said substrate;
- providing an integrated circuit having a second magnetic material associated therewith wherein said integrated circuit comprises at least one contact pad and said second magnetic material is disposed on said at least one contact pad;
- transporting said integrated circuit over said substrate toward said at least one region, whereby said second magnetic material is attracted to said first magnetic material to urge at least a portion of said integrated circuit towards said at least one region;
- establishing an electrical connection between said integrated circuit and said circuitry of said substrate through said first magnetic material and said second magnetic material;
- and
- electrically and magnetically coupling said integrated circuit to said at least one region of said substrate.
The method of 1, wherein the substrate contains circuitry, and said circuitry comprises an RFID antenna.
A method of assembling an integrated circuit to a substrate comprising:
- providing a first magnetic material associated with at least one region of said substrate;
- providing an integrated circuit having a second magnetic material associated therewith;
- vibrating said substrate to transport said integrated circuit over said substrate towards said at least one region, whereby said second magnetic material is attracted to said first magnetic material to urge at least a portion of said integrated circuit towards said at least one region.
The method of 13, wherein the substrate contains circuitry, and said circuitry comprises an RFID antenna.
Dependencies are inferred from the claim text.