Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component

An electroforming mold comprising:

• a first electroconductive layer formed on a substrate,
• a first negative type photosensitive material that is formed on the face of the first electroconductive layer opposite the face which is in contact with the substrate and has a first through-hole in the thickness direction,
• a second electroconductive layer formed on a part of the face of the first negative type photosensitive material opposite the face which is in contact with the first electroconductive layer, and
• a second negative type photosensitive material that is formed on a part of the face of the second electroconductive layer opposite the face which is in contact with the first negative type photosensitive material and has a second through-hole above the face including the edge portion of the aperture face of the first through-hole with respect to the upper face of the first negative type photosensitive material.

An electroforming mold comprising:

• an electroconductive substrate,
• a first negative type photosensitive material that is formed on the upper face of the electroconductive substrate and has a first through-hole in the thickness direction,
• a second negative type photosensitive material that is formed on a part of the upper face of the first negative type photosensitive material and has a second through-hole passing through in the thickness direction above the first through-hole, and
• an electroconductive layer formed within the second through-hole and on the upper face of the first negative type photosensitive material, the electroconductive layer not being present on the side surface of the first through-hole.

An electroforming mold comprising:

• a substrate,
• a first electroconductive layer formed on the upper face of the substrate,
• a first negative type photosensitive material that is formed on the upper face of the first electroconductive layer and has a first through-hole in the thickness direction,
• a second negative type photosensitive material that is formed on a part of the upper face of the first negative type photosensitive material and has a second through-hole passing through in the thickness direction above the first through-hole, and
• a second electroconductive layer formed within the second through-hole and on the upper face of the first negative type photosensitive material, the second elecroconductive layer not being present on the side surface of the first through-hole.

An electroforming mold comprising:

• an electroconductive substrate;
• a first negative type photosensitive material formed on an upper face of the electroconductive substrate and having a first through-hole that exposes the electroconductive substrate;
• an electroconductive layer that is formed on an upper face of the first negative type photosensitive material and surrounds the first through-hole and that is spaced from the edge of the first through-hole;
• and
• a second negative type photosensitive material formed on an upper face of the electroconductive layer and having a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole.

An electroforming mold comprising:

• a substrate;
• a first electroconductive layer formed on an upper face of the substrate;
• a first negative type photosensitive material formed on an upper face of the first electroconductive layer and having a first through-hole that exposes the first electroconductive layer;
• a second electroconductive layer that is formed on an upper face of the first negative type photosensitive material and surrounds the first through-hole and that is spaced from the edge of the first through-hole;
• and
• a second negative type photosensitive material formed on an upper face of the second electroconductive layer and having a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the second electroconductive layer that surrounds the first through-hole.

An electroforming mold comprising:

• an electroconductive substrate;
• a first negative type photosensitive material formed on an upper face of the electroconductive substrate and having a first through-hole one end of which exposes the electroconductive substrate and the side of which exposes the first negative type photosensitive material;
• a second negative type photosensitive material formed on an upper face of the first negative type photosensitive material and having a second through-hole that overlies both the first through-hole and a peripheral part of the upper face of the first negative type photosensitive material that surrounds the first through-hole;
• and
• an electroconductive layer disposed within the second through-hole on the peripheral part of the upper face of the first negative type photosensitive material and surrounding the first through-hole, the electroconductive layer not being present on the side of the first through-hole.

An electroforming mold comprising:

• a substrate;
• a first electroconductive layer formed on an upper face of the substrate;
• a first negative type photosensitive material formed on an upper face of the first conductive layer and having a first through-hole one end of which exposes the first conductive layer and the side of which exposes the first negative type photosensitive material;
• a second negative type photosensitive material formed on an upper face of the first negative type photosensitive material and having a second through-hole that overlies both the first through-hole and a peripheral part of the upper face of the first negative type photosensitive material that surrounds the first through-hole;
• and
• a second electroconductive layer disposed within the second through-hole on the peripheral part of the upper face of the first negative type photosensitive material and surrounding the first through-hole, the second electroconductive layer not being present on the side of the first through-hole.