Thin-film device and method of fabricating the same
AssigneeNEC LCD Technologies, Ltd.
InventorsKazushige Takechi, Mitsuru Nakata
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Abstract
A thin-film device includes a first electrical insulator, an oxide-semiconductor film formed on the first electrical insulator, and a second electrical insulator formed on the oxide-semiconductor film, the oxide-semiconductor film defining an active layer. The oxide-semiconductor film is comprised of a first interface layer located at an interface with the first electrical insulating insulator, a second interface layer located at an interface with the second electrical insulator, and a bulk layer other than the first and second interface layers. A density of oxygen holes in at least one of the first and second interlayer layers is smaller than a density of oxygen holes in the bulk layer.
Claims8
A thin-film device including a first electrical insulator, an oxide-semiconductor film formed on said first electrical insulator, and a second electrical insulator formed on said oxide-semiconductor film,
- said oxide-semiconductor film defining an active layer,
- said oxide-semiconductor film being comprised of a first interface layer located at an interface with said first electrical insulator, a second interface layer located at an interface with said second electrical insulator, and a bulk layer other than said first and second interface layers,
- wherein oxygen hole densities in both of said first and second interface layers are smaller than a density of oxygen holes in said bulk layer.
Dependencies are inferred from the claim text.