US 7,882,997 B2 · Method and device for mutual contacting of two wafers

Abstract

A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Claims20

Dependent claims

A device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, the device comprising:

a first receptacle unit receiving a first component composite configuration and a second receptacle unit receiving a second component composite configuration;
a seal unit for a sealed connection of the receptacle units to one another and for implementing a pressure-tight contact chamber which encloses the component composite configurations, wherein said seal unit surrounds said first component composite configuration and said second component composite configuration to form said pressure-tight contact chamber;
an attachment unit for attaching a vacuum unit to the contact chamber;
and
an energy impingement unit for a rear energy impingement of a component composite configuration via the second receptacle unit.

2 more elements

A device, comprising:

a first wafer-type component;
a second wafer-type component;
a first wafer-type component receiving unit receiving said first wafer-type component, said first wafer-type component receiving unit being mounted for movement such that said first wafer-type component receiving unit is movable between at least a first position and a second position;
a second wafer-type component receiving unit receiving said second wafer-type component, said first wafer-type component receiving unit being located at a spaced location from said second wafer-type component receiving unit in said first position, said first wafer-type component being in contact with said second wafer-type component in said second position;
a seal unit connected to said first wafer-type component receiving unit, said seal unit being in contact with said second wafer-type component receiving unit with said first wafer-type component receiving unit in said second position such that said seal unit forms a pressure-tight contact chamber with said first wafer-type component receiving unit and said second wafer-type component receiving unit, said pressure-tight contact chamber surrounding said first wafer-type component and said second wafer-type component, wherein said first wafer-type component and said second wafer-type component are sealed via said sealing unit;
a vacuum unit;
an attachment unit, wherein said vacuum unit is connected to said contact chamber via at least a portion of said attachment unit, said vacuum unit generating a vacuum in said contact chamber with said first wafer-type component receiving unit in said second position;
and
an energy impingement unit applying energy to said second wafer-type component via said second wafer-type component receiving unit with said second wafer-type component connected to said first wafer-type component.

6 more elements

A device, comprising:

a first wafer-type component having a first configuration;
a second wafer-type component having a second configuration;
a first wafer-type component receiving unit in contact with said first wafer-type component, said first wafer-type component receiving unit being mounted for movement such that said first wafer-type component receiving unit is movable between at least a wafer non-contact position, a wafer contact position and a wafer heating position;
a second wafer-type component receiving unit in contact with said second wafer-type component, said first wafer-type component receiving unit being located at a spaced location from said second wafer-type component receiving unit with said first wafer-type component receiving unit in said wafer non-contact position, said first wafer-type component being in contact with said second wafer-type component with said first wafer-type component receiving unit in said wafer contact position;
a seal unit connected to said first wafer-type component receiving unit, said seal unit being in contact with said second wafer-type component receiving unit with said first wafer-type component receiving unit in said wafer contact position such that said seal unit forms a pressure-tight contact chamber with said first wafer-type component receiving unit and said second wafer-type component receiving unit, said pressure-tight contact chamber sealing said first wafer-type component and said second wafer-type component;
a vacuum unit;
an attachment unit, wherein said vacuum unit is connected to said contact chamber via at least a portion of said attachment unit, said vacuum unit generating a vacuum in said contact chamber with said first wafer-type component receiving unit in said wafer contact position;
and
an energy impingement unit applying energy to said second wafer-type component via said second wafer-type component with said first wafer-type receiving component in said wafer heating position, said first wafer-type component being in contact with said second wafer-type component with said first wafer-type receiving component in said wafer heating position, said seal unit being in contact with said second wafer-type component receiving unit with said first wafer-type component receiving unit in said wafer heating position.

6 more elements

Dependencies are inferred from the claim text.

Method and device for mutual contacting of two wafers

Life of this patent

Method and device for mutual contacting of two wafers

Life of this patent

Abstract

Claims20