Method of manufacturing wiring board having a semiconductor thereon
AssigneeShinko Electric Industries Co., Ltd.
InventorsKei Murayama, Mitsutoshi Higashi, Masahiro Sunohara
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a wiring board having a semiconductor chip mounting surface for mounting a semiconductor chip thereon which is manufactured by a process including a step of forming a wiring layer and an insulating layer on a support board and a step of removing the support board, including a peeling layer forming step of forming a peeling layer on the support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate constituting the semiconductor chip, and a support board removing step of removing the support board by carrying out a predetermined treatment over the peeling layer.
Claims20
A method of manufacturing a wiring board having a semiconductor chip mounting surface for mounting a semiconductor chip thereon, the method comprising:
- a peeling layer forming step of forming a peeling layer on a support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate constituting the semiconductor chip;
- a wiring layer and insulating layer forming step of forming a wiring layer and an insulating layer on the support board;
- and
- a support board removing step of removing the support board by carrying out a treatment over the peeling layer.
Dependencies are inferred from the claim text.