US 7,881,068 B2Granted

Composite layer for an electronic device

AssigneeNokia Corporation

InventorsRamin Vatanparast, Mikko Aarras, Steven O. Dunford, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen, Jukka I. Rantala, Pia Tanskanen, Tetsuya Yamamoto

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Abstract

Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The composite layer includes a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the composite layer provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.

Claims10

Dependent claims

An apparatus comprising:

a first support layer;
at least one electronic component positioned on one side of the first support layer, the at least one electronic component including at least one conductive portion, the at least one conductive portion being adapted to communicate with an electronic device;
an adhesive layer disposed on the side of the first support layer carrying the at least one electronic component;
and
a second support layer disposed on the adhesive layer so that the at least one electronic component is laminated between the first and second support layers to form a composite layer, the composite layer being adapted to operably engage the electronic device such that the at least one electronic component is capable of communicating with the electronic device via the at least one conductive portion
wherein the first support layer defines at least one aperture, the at least one aperture configured to receive the at least one conductive portion of the at least one electronic component such that the at least one electronic component is recessed within the first support layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/354,536Filed 15 Jan 2009 · division
Priority: 4 May 2005
Published: US 2009/0120672 A114 May 2009
Granted: 1 Feb 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification24 codes

H05K 3/30
Apparatus or processes for manufacturing printed circuits: assembling printed circuits with electric components, e.g. with resistors
H04M 1/0283
Improving the user comfort or ergonomics: for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
H04M 1/23
Constructional features of telephone sets: construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
H05K 1/18
Printed circuits: structurally associated with non-printed electric components

Family

Application11/121,578Parent of this division · filed 4 May 2005
US 2009/0120672 A1Pre-grant publication · published 14 May 2009
US 7,523,546 B2Parent of this division
US 2006/0248713 A1Published application
US 7,881,068 B2This patent

From the US filing history. Foreign family members aren’t listed.