Substrate warpage-reducing structure

A device comprising:

• a substrate having a first coefficient of thermal expansion (CTE);
• and
• a first surface-modifying material having a second CTE, said first surface-modifying material disposed on a first surface of said substrate, wherein
• a change in an amount of warpage of said substrate is responsive, at least in part, to a difference between said first CTE and said second CTE during a temperature change of said device, and
• said first surface-modifying material is disposed on said first surface of said substrate in a first pattern that exposes portions of said first surface of said substrate so that said amount of warpage comprises a reduced amount of warpage, wherein said first pattern comprises a pattern of one or more different thicknesses of said first surface-modifying material.