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US 7,875,948 B2Granted
Backside illuminated image sensor
OwnerJaroslav Hynecek, Leonard Forbes +2inventors
InventorsJaroslav Hynecek, Leonard Forbes, Homayoon Haddad, Thomas Joy
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Abstract
A backside illuminated image sensor includes a substrate, a backside passivation layer disposed on backside of the substrate, and a transparent conductive layer disposed on the backside passivation layer.
Claims31
A backside illuminated image sensor, comprising:
- a light-receiving element disposed in a first substrate;
- an interlayer insulation layer disposed on the first substrate proximate the light-receiving element;
- an align key spaced apart from the light-receiving element and passing through the interlayer insulation layer and the first substrate;
- a plurality of interconnection layers disposed on the interlayer insulation layer in a multi-layered structure, wherein a backside of a backmost interconnection layer of the plurality of interconnection layers is electrically coupled to the align key;
- a front side passivation layer disposed on a frontmost layer of the plurality of interconnection layers;
- a backside passivation layer disposed on a backside of the first substrate;
- a transparent conductive layer disposed on the backside passivation layer proximate the light-receiving element, wherein the transparent conductive layer is electrically coupled to the align key;
- and
- a color filter and a microlens disposed on the transparent conductive layer in a region of the first substrate overlying the light-receiving element.
6 more elements
A backside illuminated image sensor, comprising:
- a light-receiving element disposed in a substrate;
- an interconnection layer disposed over a front side of the substrate, wherein the interconnection layer includes a patterned metal layer and a patterned insulating layer;
- a conductive align key passing through the interconnection layer and the substrate, wherein the conductive align key is electrically coupled to a conductive pad of the patterned metal layer;
- and
- a transparent conductive layer disposed over a backside of the substrate, wherein the transparent conductive layer is electrically coupled to the conductive align key to provide an electrically conductive path between the conductive pad and the transparent conductive layer through the conductive align key.
2 more elements
A backside illuminated image sensor, comprising:
- a light-receiving element disposed in a substrate;
- an interconnection layer disposed over a front side of the substrate, wherein the interconnection layer comprises a patterned metal layer and a patterned insulating layer;
- a conductive align key passing through the interconnection layer and the substrate, wherein the conductive align key is electrically coupled to a conductive pad of the patterned metal layer, and wherein the conductive pad is configured to receive a bias voltage;
- and
- a transparent conductive layer disposed over a backside of the substrate, wherein the transparent conductive layer is electrically coupled to the conductive align key and configured to provide the bias voltage to the transparent conductive layer.
2 more elements
Dependencies are inferred from the claim text.