Reduced-crosstalk wirebonding in an optical communication system
AssigneeAvago Technologies Fiber IP (Singapore) Pte. Ltd.
InventorsPeter Ho, Michael A. Robinson, Zuowei Shen
Life of this patent
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Abstract
Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.
Claims17
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond crossing the first wirebond and coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- and
- a third wirebond coupling the opto-electronic device chip to the signal processing chip, wherein the third wirebond does not cross either of the first and second wirebonds.
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond;
- and
- a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, the third wirebond coupling an N-terminal of the opto-electronic device to the signal processing chip.
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond;
- and
- a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, the third wirebond coupling a fixed potential terminal of the opto-electronic device chip to the signal processing chip.
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond;
- and
- a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, wherein the second and third wirebonds couple an N-terminal of the opto-electronic device to a filtered power supply of the signal processing chip.
A system for coupling an opto-electronic detector chip having a plurality of opto-electronic detectors to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic detectors, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic detector of the wirebond group to the signal processing chip, the first wirebond coupling an N-terminal of the opto-electronic detector to an amplifier of the signal processing chip;
- a second wirebond coupling an N-terminal of the opto-electronic detector of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond;
- and
- a third wirebond coupling the opto-electronic detector chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, wherein the second and third wirebonds couple a P-terminal of the opto-electronic detector to a fixed potential.
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond crossing the first wirebond and coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- and
- a third wirebond crossing both the first wirebond and the second wirebond and coupling the opto-electronic device chip to the signal processing chip.
Dependencies are inferred from the claim text.