Display device and method of manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsSetsuo Nakajima, Shunpei Yamazaki
Life of this patent
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Abstract
To provide a technique for manufacturing a high-performance display device by employing a plastic substrate. A peeling layer is formed on an element-forming substrate, and a semiconductor element and a luminous element are further formed thereon. Then, a fixed substrate (130) is bonded on the luminous element by using a first adhesive (129). The entire substrate in this state is exposed in a gas containing halogen fluoride to thereby remove the peeling layer and separate the element-forming substrate. Thereafter, a bonding substrate (132) that comprises a plastic substrate is bonded in place of the separated element-forming substrate.
Claims13
A method of manufacturing a display device, comprising the steps of:
- forming a peeling layer on an element-forming substrate;
- forming an insulating layer on said peeling layer;
- forming an active layer, a gate insulating layer, and gate electrodes over said insulating layer;
- forming first openings in said gate insulating layer, said insulating layer, and said peeling layer;
- forming a first interlayer insulating layer to cover said gate electrodes;
- forming wirings and a pixel electrode on said first interlayer insulating layer;
- forming second openings in said first interlayer insulating layer, said gate insulating layer, and said insulating layer to thereby expose said peeling layer;
- exposing the entire substrate to a gas containing halogen fluoride to thereby remove said peeling layer;
- forming a second interlayer insulating layer to cover said wirings and said pixel electrode;
- etching said second interlayer insulating layer to thereby expose said pixel electrode;
- forming a luminous layer and a cathode on said pixel electrode;
- bonding a fixed substrate on said cathode by using a first adhesive;
- removing said element-forming substrate after bonding said fixed substrate;
- and
- bonding a bonding substrate to said insulating layer by using a second adhesive.
A method of manufacturing a display device, comprising the steps of:
- forming a peeling layer on an element-forming substrate;
- forming an insulating layer on said peeling layer;
- forming active layers, a gate insulating layer, and gate electrodes over said insulating layer;
- forming first openings in said gate insulating layer, said insulating layer, and said peeling layer;
- forming a first interlayer insulating layer to cover said gate electrodes;
- forming wirings and a pixel electrode on said first interlayer insulating layer;
- forming second opening in said first interlayer insulating layer, said gate insulating layer, and said insulating layer to thereby expose said peeling layer;
- removing said peeling layer;
- forming a second interlayer insulating layer to cover said wirings and said pixel electrode;
- etching said second interlayer insulating layer to thereby expose said pixel electrode;
- forming a luminous layer and a cathode on said pixel electrode;
- bonding a fixed substrate on said cathode by using a first adhesive;
- removing said element-forming substrate after bonding said fixed substrate;
- and
- bonding a bonding substrate to said insulating layer by using a second adhesive.
A method of manufacturing a display device, comprising the steps of:
- forming a peeling layer on an element-forming substrate;
- forming an insulating layer on said peeling layer;
- forming active layers, a gate insulating layer, and gate electrodes over said insulating layer;
- forming first openings in said gate insulating layer, said insulating layer, and said peeling layer;
- forming a first interlayer insulating layer to cover said gate electrodes;
- forming wirings and a pixel electrode on said first interlayer insulating layer;
- forming second opening in said first interlayer insulating layer, said gate insulating layer, and said insulating layer to thereby expose said peeling layer;
- removing said peeling layer;
- forming a second interlayer insulating layer to cover said wirings and said pixel electrode;
- etching said second interlayer insulating layer to thereby expose said pixel electrode;
- forming a luminous layer and a cathode on said pixel electrode;
- bonding a fixed substrate on said cathode by using a first adhesive;
- removing said element-forming substrate after bonding said fixed substrate;
- and
- bonding a bonding substrate to said insulating layer by using a second adhesive,
- wherein the luminous layer emits a white light.
Dependencies are inferred from the claim text.