Packaged semiconductor assemblies and methods for manufacturing such assemblies
AssigneeMicron Technology, Inc.
InventorsSuan Jeung Boon, Meow Koon Eng, Yong Poo Chia
Life of this patent
Estimating the term…
Abstract
Packaged semiconductor assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One embodiment of a packaged semiconductor assembly includes a support member having a first bond-site and a die carried by the support member having a second bond-site. An interconnect structure is connected between the first and second bond-sites and includes a wire that is coupled to at least one of the first and second bond-sites. The interconnect structure also includes a third bond-site coupled to the wire between the first and second bond-sites.
Claims23
A semiconductor assembly, comprising:
- a support member having a first bond-site;
- a die carried by the support member and having a second bond-site;
- and
- an interconnect structure connected between the first and second bond-sites and including a wire coupled to at least one of the first and second bond-sites and a third bond-site coupled to the wire between the first and second bond-sites.
A method of forming a semiconductor assembly, comprising:
- attaching a support member having a first bond-site to a die having a second bond-site;
- attaching a wire to at least one of the first and second bond-sites;
- encasing at least a portion of the wire and the first and second bond-sites with an encapsulant;
- and
- coupling a third bond-site to the wire.
A semiconductor assembly, comprising:
- a support member having a first bond-site;
- a die carried by the support member and having a second bond-site;
- and
- an interconnect structure electrically coupling the first bond-site to the second bond-site, wherein the interconnect structure comprises
- a wire having a first end portion connected to the first bond-site, a second end portion connected to the second bond-site, and an intermediate portion extending between the first and second end portions;
- and
- a third bond-site coupled to the intermediate portion of the wire.
Dependencies are inferred from the claim text.