Method of producing pattern-formed structure and photomask used in the same

A method of producing a pattern-formed structure, comprising the processes of:

• preparing a substrate for a pattern-formed structure having a characteristic-modifiable layer whose characteristic at a surface thereof can be modified by the action of a photocatalyst-containing-layer side substrate having a photocatalyst-containing layer formed on a based base material, the photocatalyst-containing layer containing photocatalyst layer with a gap of no larger than 200 μm between the photocatalyst-containing layer and the characteristic-modifiable layer;
• and
• irradiating energy to the characteristic-modifiable layer from a predetermined direction, and modifying a characteristic of a surface of the characteristic-modifiable layer, thereby forming a pattern at the characteristic-modifiable layer,
• wherein the photocatalyst-containing-layer side substrate comprises the base material and the photocatalyst-containing layer formed, in a pattern-like configuration, on the base material, and
• the irradiation of energy at the pattern forming process is carried out from a side of the substrate for a pattern-formed structure.

A method of producing a pattern-formed structure, comprising the processes of.

• preparing a substrate for a pattern-formed structure having a characteristic-modifiable layer whose characteristic at a surface thereof can be modified by the action of photocatalyst;
• arranging the substrate for a pattern-formed structure and a photocatalyst-containing-layer side substrate having a photocatalyst-containing layer formed on a base material, the photocatalyst-containing layer containing photcatalyst, such that the characteristic-modifiable layer faces the photocatalyst-containing layer with a gap of no larger than 220 μm therebetween;
• and
• irradiating energy to the characteristic-modifiable layer from predetermined direction, modifying a characteristic of a surface of the characteristic-modifiable layer, thereby forming a pattern at the characteristic-modifiable layer,
• wherein the irradiation of energy at the pattern forming process is a drawing irradiation by laser beam.

A method of producing a pattern-formed structure, comprising the processes of:

• arranging a photocatalyst-containing-layer side substrate in which a photocatalyst-containing layer is formed on a photomask by way of a primer layer, the photomask being formed by providing a light-shielding portion, in a pattern-like configuration, on a transparent base material, and a substrate for a pattern-formed structure having a characteristic-modifiable layer whose characteristic can be modified by the action of photocatalyst contained at least in the photocatalyst-containing layer:
• such that the photocatalyst-containing layer and the substrate for a pattern-formed structure are in contact with each other;
• or such that the characteristic-modifiable layer faces the photocatalyst-containing layer with a gap therebetween, the gap being narrow enough to allow the action of the photocatalyst-containing layer to effect on the characteristic-modifiable layer;
• effecting irradiation of energy to the substrates, thereby modifying a characteristic of the irradiated portion of the characteristic-modifiable layer;
• and
• removing the photocatalyst-containing-layer side substrate, thereby obtaining a pattern-formed structure,
• wherein the irradiation of energy is a drawing irradiation by laser beam.