Apparatus and method for forming holes and for placing materials into sub-surface

An apparatus for forming holes in ground and for placing hygroscopic particles into the holes, comprising:

• a first chamber configured to hold a liquid;
• a second chamber configured to hold the hygroscopic particles;
• a first pressure mechanism operable to maintain the liquid in the first chamber at a first pressure level;
• a second pressure mechanism operable to maintain the hygroscopic particles in the second chamber at a second pressure level;
• a first valve operable during a first time period to regulate the delivery of the liquid into a third chamber through a first opening;
• a second opening configured to direct jets of liquid from the third chamber during the first time period to form holes in the ground;
• a second valve operable during a second time period to regulate the delivery of the hygroscopic particles to the third chamber;
• and
• the first valve operable during a third time period to regulate the delivery of the liquid to the third chamber through the first opening causing jets of the hygroscopic particles to be directed through the second opening into the holes;
• and
• a control system configured to receive a distance information and in response operable to cause the first valve to regulate the delivery of the liquid into the third chamber and to cause the second valve to regulate the delivery of the hygroscopic particles into the third chamber, wherein the control system comprises a programmable logic controller operable responsive to the distance information to generate first and second control signals to control the respective first and second valves.