# US 7,844,357 B2 · Controlling device for substrate processing apparatus and method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,844,357 B2 - Document ID: US7844357B2 - Status: Granted - Kind: B2 - Application number: 11/874,626 - Filed: 2007-10-18 - Published: 2009-05-21 - Granted: 2010-11-30 - Earliest claimed: 2006-10-20 - Assignees: Tokyo Electron Limited - Inventors: Shinji Sakano - Web page: https://patentgrep.com/patent/US7844357B2 ## CPC - G05B 19/41875: {characterised by quality surveillance of production} - G05B 2219/32097: Recipe programming for flexible batch - G05B 2219/32182: If state of tool, product deviates from standard, adjust system, feedback - G05B 2219/32198: Feedforward inspection data for calibration, manufacturing next stage - G05B 2219/37575: Pre-process, measure workpiece before machining - G05B 2219/37576: Post-process, measure worpiece after machining, use results for new or same - G05B 2219/45031: Manufacturing semiconductor wafers - H10P 50/266: {by vapour etching only} - Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM. ## Claims ### Claim 1 A controlling device for controlling a substrate processing apparatus that performs a specified process on a substrate, the controlling device comprising: a storage unit that stores a plurality of recipes that respectively indicate different processing sequences, and a specified target value that serves as a control value when the specified process is performed on the substrate; a communication unit that causes a measuring device to measure measurement information including a pre-processing state and a post-processing state of the substrate that is processed by the substrate processing apparatus in accordance with a processing sequence indicated in a first recipe included among the plurality of recipes stored in the storage unit, and receives the measurement information; a computation unit that computes a feedback value that corresponds to a process state of the substrate processed in the current cycle, based on the pre-processing state and the post-processing state measurement information for the substrate processed in the current cycle within the measurement information received by the communication unit; an update unit that updates the target value stored in the storage unit using the feedback value computed by the computation unit; a recipe adjustment unit that changes the recipe that indicates the processing sequence performed in the substrate processing apparatus from the first recipe to a second recipe, the first recipe and the second recipe being stored in the storage unit; and a process execution control unit that controls a processing of a substrate transferred in the substrate processing apparatus with feed forward control while using the target value updated by the update unit, in accordance with the processing sequence indicated in the second recipe, wherein the second recipe is different from the first recipe, but uses the target value updated by the update unit, wherein the storage unit stores a plurality of feed forward plans that respectively indicate a processing sequence for performing feed forward control, each feed forward plan including the target value, wherein the process execution control unit accesses the plurality of feed forward plans stored in the storage unit, wherein even if the recipe adjustment unit changes the recipe that indicates the processing sequence performed in the substrate processing apparatus from the first recipe to the second recipe, the same feed forward plan is selected, and wherein the process execution control unit continues to use the target value contained in the same feed forward plan that has been selected to perform feed forward control for a substrate transferred in the substrate processing apparatus. ### Claim 2 (depends on 1) The controlling device according to claim 1, wherein the storage unit stores a plurality of target values, and the process execution control unit accesses the plurality of the target values stored in the storage unit. ### Claim 3 (depends on 2) The controlling device according to claim 2, wherein the process execution control unit continues to use the same target value that has been selected to perform feed forward control for a substrate transferred in the substrate processing apparatus. ### Claim 4 (depends on 2) The controlling device according to claim 2, wherein the controlling device controls a plurality of the substrate processing apparatuses, the storage unit stores respective target values for each substrate processing apparatus as a linked relationship between each one of the target values and the each substrate processing apparatus, the recipe adjustment unit selects, from among the plurality of target values stored in the storage unit, the stored target value that has a linked relationship with the substrate processing apparatus that the next substrate to be processed is transferred into, and the process execution control unit controls the processing of the substrate transferred into the substrate processing apparatus with feed forward control based on the selected target value. ### Claim 5 (depends on 1) The controlling device according to claim 1, wherein the process execution control unit optimizes the target value in accordance with the processing sequence indicated in the second recipe, and uses the updated target value to perform feed forward control for a substrate transferred in the substrate processing apparatus in accordance with the processing sequence indicated in the second recipe. ### Claim 6 (depends on 1) The controlling device according to claim 1, wherein the received measurement information is information for computing at least one of a substrate critical dimension, an etching rate, and a deposition rate. ### Claim 7 (depends on 1) The controlling device according to claim 1, wherein the target value is a parameter that indicates a process condition. ### Claim 8 (depends on 7) The controlling device according to claim 7, wherein the parameter that indicates the process condition is at least one of a substrate processing time, a pressure, a power, a temperature of a specified position in the substrate processing apparatus, a mixture ratio of a plurality of types of gases, and a gas flow volume. ### Claim 9 (depends on 1) The controlling device according to claim 1, wherein the specified process is an etching process. ### Claim 10 (depends on 1) The controlling device according to claim 1, wherein both the first and second recipes are etch recipes. ### Claim 11 (depends on 10) The controlling device according to claim 10, wherein the target value is an etching rate. ### Claim 12 (depends on 1) The controlling device according to claim 1, wherein the updated target value is stored separately from the first and second recipes. ### Claim 13 (depends on 1) The controlling device according to claim 1, wherein the feed forward plan is a numerical relation that is a function of the updated target value. ### Claim 14 (depends on 13) The controlling device according to claim 13, wherein the feed forward plan provides an etch time based on the updated target value. ### Claim 15 A control method for controlling a substrate processing apparatus that performs a specified process on a substrate, the control method comprising: storing in a storage unit a plurality of recipes that respectively indicate different processing sequences, and a specified target value that serves as a control value when the specified process is performed on the substrate; causing a measuring device to measure measurement information including a pre-processing state and a post-processing state of the substrate that is processed by the substrate processing apparatus in accordance with a processing sequence indicated in a first recipe included among the plurality of recipes stored in the storage unit; receiving the measured measurement information; computing a feedback value that corresponds to a processed state of the substrate processed in the current cycle, based on pre-processing state and post-processing state measurement information for the substrate processed in a current cycle within the received measurement information; updating, via an update unit, the target value stored in the storage unit using the computed feedback value; changing a recipe that indicates the processing sequence performed in the substrate processing apparatus from the first recipe to the second recipe, the first recipe and a second recipe is stored in the storage unit; and controlling a processing of a substrate transferred in the substrate processing apparatus with feed forward control while using the updated target value, in accordance with the processing sequence indicated in the second recipe, wherein the second recipe is different from the first recipe, but uses the target value updated by the update unit, wherein the storage unit stores a plurality of feed forward plans that respectively indicate a processing sequence for performing feed forward control, each feed forward plan including the target value, wherein a process execution control unit accesses the plurality of feed forward plans stored in the storage unit, wherein even if the recipe that indicates the processing sequence performed in the substrate processing apparatus is changed from the first recipe to the second recipe, the same feed forward plan is selected, and wherein the process execution control unit continues to use the target value contained in the same feed forward plan that has been selected to perform feed forward control for a substrate transferred in the substrate processing apparatus. ### Claim 16 (depends on 15) The method of claim 15, wherein both the first and second recipes are etch recipes. ### Claim 17 (depends on 16) The method of claim 16, wherein the target value is an etching rate. ### Claim 18 (depends on 15) The method according to claim 15, wherein the target value is stored separately from the first and second recipes. ### Claim 19 (depends on 15) The method according to claim 15, wherein the feed forward plan is a numerical relation that is a function of the updated target value. ### Claim 20 (depends on 19) The method according to claim 19, wherein the feed forward plan provides an etch time based on the updated target value. ### Claim 21 A storage medium that stores a control program for a substrate processing apparatus that performs a specified process on a substrate, to control the substrate processing apparatus by executing the control program with a computer, the control program comprising: a module that stores in a storage unit a plurality of recipes that respectively indicate different processing sequences, and a specified target value that serves as a control value when the specified process is performed on the substrate; a module that causes a measuring device to measure measurement information including a pre-processing state and a post-processing state of the substrate that is processed by the substrate processing apparatus in accordance with a processing sequence indicated in a first recipe included among the plurality of recipes stored in the storage unit; a module that receives the measurement information; a module that computes a feedback value that corresponds to a processed state of the substrate processed in the current cycle, based on the pre-processing state and the post-processing state measurement information for the substrate processed in the current cycle within the received measurement information; a module that updates, via an update unit, the target value stored in the storage unit using the computed feedback value; a module that changes a recipe that indicates the processing sequence performed in the substrate processing apparatus from the first recipe to the second recipe, the first recipe and a second recipe is stored in the storage unit; and a module that controls a processing of a substrate transferred in the substrate processing apparatus with feed forward control while using the updated target value, in accordance with the processing sequence indicated in the second recipe, wherein the second recipe is different from the first recipe, but uses the target value updated by the update unit, wherein the storage unit stores a plurality of feed forward plans that respectively indicate a processing sequence for performing feed forward control, each feed forward plan including the target value, wherein the module that controls processing of a substrate accesses the plurality of feed forward plans stored in the storage unit, wherein even if the module that changes a recipe changes the recipe that indicates the processing sequence performed in the substrate processing apparatus from the first recipe to the second recipe, the same feed forward plan is selected, and wherein the module that controls processing of a substrate continues to use the target value contained in the same feed forward plan that has been selected to perform feed forward control for a substrate transferred in the substrate processing apparatus. ### Claim 22 (depends on 21) The storage device of claim 21, wherein both the first and second recipes are etch recipes. ### Claim 23 (depends on 22) The storage device of claim 22, wherein the target value is an etching rate. ### Claim 24 (depends on 21) The storage medium according to claim 21, wherein the updated target value is stored separately from the first and second recipes. ### Claim 25 (depends on 21) The storage medium according to claim 21, wherein the feed forward plan is a numerical relation that is a function of the updated target value. ### Claim 26 (depends on 25) The storage medium according to claim 25, wherein the feed forward plan provides an etch time based on the updated threshold value.