Label with electronic components and method of making same
AssigneeAvery Dennison Corporation
InventorsPeter Phaneuf, Gary P. Burns
Life of this patent
Estimating the term…
Abstract
A method of making an electronic label, such as an RFID label, includes attaching a circuit, such as an antenna, to a substrate material, applying an adhesive layer to the substrate material over the circuit, adding a release layer over the adhesive layer, forming at least one opening in the release layer to expose at least one portion of the circuit, and connecting a microchip to the at least one portion of the circuit through the at least one opening. The circuit can be an RFID inlay, including an antenna and a microchip, and can be formed of a conductive ink. A portion of the release layer at the at least one microchip has an opening to expose the at least one microchip so that the at least one microchip is free from coverage by the release layer.
Claims18
A label web comprising;
- a web of material, the material web having first and second sides;
- a plurality of antennas each having antenna contacts applied to the first side of the web;
- a removable release layer and an adhesive layer applied over the plurality of antennas, the web with the plurality of antennas is provided without a microchip;
- a printable surface on the second side of the web;
- and
- wherein the release layer and adhesive layer each have at least one opening over each of the antenna contacts of the plurality of antennas wherein the opening is sized and configured to receive a microchip;
- and
- wherein multiple microchips are coupled to respective antennas through respective openings.
A pressure sensitive label, comprising;
- a substrate having first and second sides;
- an antenna, having antenna contacts is applied to the first side;
- printed indicia on the second side;
- a removable release layer and an adhesive layer applied over the antenna, the substrate and antenna are
- provided without a microchip;
- and
- wherein each of the release layer and the adhesive layer has an opening over the antenna contacts wherein the opening is sized and configured to receive a microchip;
- and
- wherein multiple microchips are coupled to respective antennas through respective openings.
A pressure sensitive web of material, comprising:
- a substrate having first and second sides;
- a series of antennas each having antenna contacts applied to the first side;
- printed indicia applied to the second side;
- and
- a removable release layer and an adhesive layer applied over the series of antennas, the substrate with antennas is provided without a microchip;
- wherein for each of the antenna contacts there is an opening extending through each of the adhesive layer and the release layer wherein the opening is sized and configured to receive a microchip;
- and
- wherein the opening is sized and configured to receive a microchip;
- and wherein multiple microchips are coupled to respective antennas through respective openings.
Dependencies are inferred from the claim text.