Grounding of magnetic cores
AssigneeIntel Corporation
InventorsGerhard Schrom, Donald Gardner, Peter Hazucha, Fabrice Paillet, Tanay Karnik
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Abstract
An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die.
Claims16
An apparatus, comprising:
- a first magnetic layer;
- a second magnetic layer underneath the first magnetic layer;
- a conductive pattern at a third layer between the first magnetic layer and the second magnetic layer;
- one or more grounded conductive layers;
- and
- one or more vias to provide a connection between the first magnetic layer, the second magnetic layer and the grounded conductive layer, wherein the vias and the magnetic layers form a magnetic core.
Dependencies are inferred from the claim text.