Process monitor for monitoring an integrated circuit chip
AssigneeBroadcom Corporation
InventorsLawrence M. Burns, Leonard Dauphinee, Ramon A. Gomez, James Y. C. Chang
Life of this patent
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Abstract
A system or apparatus for monitoring an Integrated Circuit (IC) chip includes: a sense circuit at least partially constructed on the IC chip and configured to produce one or more sense signals each indicative of a corresponding process-dependent circuit parameter of the IC chip; and a digitizer module configured to produce, responsive to the one or more sense signals, one or more digitized signals each representative of a corresponding one of the sense signals. A controller is configured to determine a value of one or more of the process-dependent circuit parameters based on one or more of the digitized signals.
Claims20
A system for monitoring an integrated circuit chip, comprising:
- a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip;
- and
- a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a temperature of the integrated circuit chip.
A system for monitoring an integrated circuit chip, comprising:
- a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip;
- and
- a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a power supply voltage of the integrated circuit chip.
A system for monitoring an integrated circuit chip, comprising:
- a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a temperature of the integrated circuit chip;
- a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a power supply voltage of the integrated circuit chip;
- and
- a third circuit at least partially disposed on the integrated circuit chip and configured to produce a third signal, wherein the third signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip.
A system for monitoring an integrated circuit chip, comprising:
- a first sensor at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a first manufacturing process-dependent circuit parameter;
- a second sensor at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a second manufacturing process-dependent circuit parameter;
- an analog multiplexer configured to multiplex the first signal and the second signal;
- and
- an analog-to-digital converter configured to receive, from the analog multiplexer, the first signal and the second signal and to produce a digital representation of the first signal and a digital representation of the second signal.
A system for monitoring an integrated circuit chip, comprising:
- a first circuit disposed on the integrated circuit chip and configured to determine a measure of a manufacturing process-dependent circuit parameter, to convert the measure of the manufacturing process-dependent circuit parameter into a first signal, and to communicate the first signal to a controller;
- and
- a second circuit disposed on the integrated circuit chip and configured to receive a second signal from the controller and to cause an adjustment of an operation performed on the integrated circuit chip, wherein the adjustment is in response to the measure of the manufacturing process-dependent circuit parameter.
Dependencies are inferred from the claim text.