Apparatus for testing devices
AssigneeFormFactor, Inc.
InventorsEric D. Hobbs, Nobuhiro Kawamata, Andrew W. McFarland, Carl V. Reynolds, Yoichi Urakawa
Life of this patent
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Abstract
Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
Claims24
An assembly for testing semiconductor devices, comprising:
- a probe card assembly comprising a stiffener assembly, wherein a portion of the stiffener assembly has a high thermal conductivity;
- and
- a thermal barrier disposed proximate an upper surface of the probe card assembly and positioned to restrict thermal transfer between tester side boundary conditions and the high thermal conductivity portion of the stiffener assembly.
An assembly for testing semiconductor devices, comprising:
- a probe card assembly, wherein the probe card assembly comprises a high thermal conductivity stiffener centrally disposed relative to a low thermal conductivity substrate;
- and a cap disposed above an upper central surface of the probe card assembly, the cap providing a thermal barrier between tester side boundary conditions and portions of the probe card assembly disposed beneath the cap, wherein the cap substantially covers the probe card assembly.
A probe card assembly, comprising:
- a wiring substrate having a tester side surface, an opposing wafer side surface, and a plurality of through holes extending therebetween wherein the wiring substrate has a low thermal conductivity;
- a support structure attached to the tester side surface of the wiring substrate and having portions extending into the through holes, wherein the support structure has a high thermal conductivity, and is centrally disposed relative to the wiring substrate;
- a probe substrate located proximate to the wafer side surface of the wiring substrate and attached to the support structure;
- and a cap disposed on an upper surface of the support structure, the cap providing a thermal barrier between tester side boundary conditions and portions of the probe card assembly disposed beneath the cap, wherein the cap substantially covers the support structure.
Dependencies are inferred from the claim text.