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US 7,843,089 B2Granted
Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMikihiko Ito, Masaru Koyanagi, Katsuki Matsudera
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Abstract
A semiconductor device comprises a board; a semiconductor chip; a memory controller operative to control the semiconductor chip; and a power supply chip having a capacitor. The semiconductor chip is stacked on the board. The memory controller and the power supply chip are stacked on the semiconductor chip. The capacitor is used to stabilize the voltage applied to the semiconductor chip.
Claims10
A semiconductor device, comprising:
- a board;
- a semiconductor chip;
- a memory controller operative to control said semiconductor chip;
- and
- a power supply chip having a capacitor,
- said semiconductor chip being stacked on said board,
- said memory controller and said power supply chip being stacked on said semiconductor chip,
- said semiconductor chip or said memory controller being stacked on said power supply chip,
- said capacitor being used to stabilize the voltage applied to said semiconductor chip,
- said power supply chip being rectangular shaped as viewed from above, and
- said power supply chip comprising:
- a plurality of first electrodes provided along only a longer side of said power supply chip;
- a plurality of second electrodes provided along only a shorter side of said power supply chip;
- and
- a plurality of corresponding wiring patterns electrically connecting said plurality of first electrodes and said plurality of second electrodes.
12 more elements
Dependencies are inferred from the claim text.