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US 7,843,075 B2Granted
Apparatus and methods of forming an interconnect between a workpiece and substrate
AssigneeIntel Corporation
InventorsLakshmi Supriya, Anna M. Prakash, Tommy L. Ashton
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Abstract
Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
Claims20
A method of forming an interconnect between a workpiece and a bumped substrate with a low temperature glass transition film, comprising:
- forming a plurality of indentations in the film;
- applying flux to the indentations to form a flux loaded film;
- placing the flux loaded film on the bumped substrate;
- heating the bumped substrate and the flux loaded film to form flux coated solder bumps on the bumped substrate;
- and
- reflowing the bumped substrate to form the interconnect with the workpiece.
3 more elements
A method of forming a wafer level package, comprising:
- applying flux to an embossed low glass transition temperature film;
- positioning the embossed low glass transition temperature film on a bumped substrate;
- placing a workpiece on the embossed low glass transition temperature film;
- and
- heating the embossed low glass transition temperature film, bumped substrate, and workpiece to form an interconnect in the wafer level package.
2 more elements
An apparatus, comprising:
- a substrate with solder bumps attached to the substrate, wherein the solder bumps are separated by a gap;
- a low glass transition temperature film material positioned in the gap;
- an underfill material adjacent to the low glass transition temperature film material;
- a workpiece comprising a plurality of bond-pads, wherein the workpiece is connected to the substrate through the bond-pads and the solder bumps.
1 more element
Dependencies are inferred from the claim text.